The influence of surface treatment technology on PCB performance

The performance of circuit boards directly affects the working stability and reliability of electronic equipment. As a key step in the PCB manufacturing process, surface treatment technology plays a vital role in the overall performance of PCB. The following will explore the specific effects of different surface treatment technologies on PCB performance.

1. Overview of PCB surface treatment technology

PCB surface treatment technology mainly includes the following types:

Hot air leveling (HASL): This process applies a layer of molten solder to the surface of the circuit board, and then blows away the excess solder with hot air. This layer of solder protects the circuit board from oxygen in the air and helps to ensure good connections when soldering components on the circuit board later.

Electroless nickel gold (ENIG): A layer of nickel is first applied to the circuit board, and then a thin layer of gold is covered. This treatment not only prevents the surface of the circuit board from being worn, but also allows the current to pass through the circuit more smoothly, which is conducive to the long-term use of the circuit board.

Electroless nickel immersion gold (IMnG): Similar to ENIG, but less gold is used when plating gold. It applies a thin layer of gold on the nickel layer on the surface of the circuit board, which can maintain good conductivity, save gold and reduce costs.

Organic protective film (OSP): A protective layer is formed by applying a layer of organic material on the copper surface of the circuit board to prevent copper from oxidizing and discoloring. In this way, the circuit board can maintain a good connection effect during soldering, and the soldering quality will not be affected by oxidation.

Direct copper gold plating (DIP): A layer of gold is directly plated on the copper surface of the circuit board. This method is particularly suitable for high-frequency circuits because it can reduce interference and loss in signal transmission and ensure the quality of the signal.

2. The impact of surface treatment technology on PCB board performance

1. Conductive performance

ENIG: Due to the high conductivity of gold, ENIG-treated PCB have excellent electrical properties.

OSP: Although the OSP layer can prevent copper oxidation, it may affect the conductive performance.

2. Wear resistance and corrosion resistance

ENIG: The nickel layer provides good wear resistance and corrosion resistance.

HASL: The solder layer can provide some protection, but it is not as stable as ENIG.

3. Soldering performance

HASL: Due to the presence of the solder layer, HASL-treated PCB have better soldering performance.

ENIG: Although ENIG provides good soldering performance, the gold layer may affect the mechanical strength after soldering.

4. Environmental adaptability

OSP: The OSP layer can provide good environmental adaptability and is suitable for use in humid environments.

DIP: Due to the stability of gold, DIP-treated PCB perform well in harsh environments.

5. Cost factors

Different surface treatment technologies have different impacts on the cost of PCB. ENIG and DIP are relatively expensive due to the use of precious metals.

Surface treatment technology has a significant impact on the performance of PCB. Choosing the right surface treatment technology requires comprehensive consideration based on application scenarios, cost budgets, and performance requirements. With the development of technology, new surface treatment technologies continue to emerge, providing more possibilities for PCB design and manufacturing.