High-speed PCB design in the laying of copper processing methods

In the high-speed PCB design, copper is a very important part of the processing method. Because high-speed PCB design needs to rely on the copper layer to provide high-speed signal transmission support, so in the process of laying copper, we need to do the following.

1. Reasonable planning of the thickness and composition of the copper layer

In high-speed PCB design, the thickness and composition of the copper layer for signal transmission is very big. Therefore, we need to according to the design requirements, before the design of the copper layer planning. Generally speaking, when we lay copper, we can use the inner layer of copper and outer layer of copper in two ways. The main role of the inner layer of copper is to provide electrical connections for the PCB board, can be in the signal transmission before the way through the copper paving to eliminate electromagnetic waves within the board, improve signal stability. The outer layer of copper is mainly to improve the mechanical strength of the PCB board.

2. Adopt appropriate copper laying method

In the high-speed PCB design, we need to use the appropriate copper laying method to ensure the stability of signal transmission. Generally speaking, we can use rectangular copper, oblique copper, copper ring and other ways. Among them, rectangular copper is the most commonly used way to ensure the uniformity and consistency of the copper layer. Slanted copper can effectively improve the avoidance of electromagnetic waves, thereby improving the stability of signal transmission. Circular copper paving can avoid the signal directly through the hole, thus reducing the inconsistency of the impedance. 

3. copper laying before the need for board processing

In high-speed PCB design, laying copper before we need to deal with the board. Generally speaking, we need to carry out chemical treatment of the board, mechanical grinding, film removal and other steps. Among them, the chemical treatment is to remove the oxide layer and impurities on the surface of the board to improve the flatness of the board surface. Mechanical grinding is to eliminate undesirable bumps and depressions on the surface of the plate to further improve the flatness of the surface of the plate. De-filming refers to the removal of the protective film on the surface of the plate, in preparation for the laying of copper.

4. Ensure the uniformity of the copper layer

In high-speed PCB design, the uniformity of the copper layer is also very important for the stability of signal transmission. Therefore, we need to use some methods to ensure the uniformity of the copper layer. Generally speaking, we can use electrolytic copper, electroplating copper, chemical deposition of copper and other ways to carry out the growth of copper layer. Among them, electrolytic copper can get the best plating uniformity, but the production process is more complicated. Electroplated copper can get more uniform copper layer, the production process is relatively simple. Chemical deposition of copper can get more uniform copper layer, but need to pay attention to the stability of the deposition solution and processing technology.

In short, in the high-speed PCB design in the laying of copper processing method is a very important work. Through the reasonable planning of the thickness and composition of the copper layer, the use of appropriate copper laying method, laying copper before the plate for processing and ensure the uniformity of the copper layer, we can effectively improve the signal transmission speed and stability of the PCB board.

Shenzhen Jiubao Technology Co., Ltd. is a company specializing in the development and production of electronic products circuit boards, mainly to undertake multi-layer, high-density mass production, fast boards, sampling business. With an average of more than 15 years of experience in PCB design team, professional and efficient communication to ensure the progress of PCB production, to help you seize the market opportunity earlier!