PCB double-layer board heat dissipation solution

As the performance of electronic devices continues to improve, heat dissipation has become a challenge that cannot be ignored in design. Especially in high-density double-layer PCB design, effective heat dissipation solutions help ensure long-term stable operation of the equipment. The following mainly introduces several heat dissipation solutions for double-layer PCB.

1. Challenges of heat dissipation of double-layer boards

Due to its structural limitations, double-layer PCB face some challenges in heat dissipation:

Space limitations: The thickness and space of double-layer boards limit the possibility of heat dissipation design.

Heat source concentration: High-density component layout may lead to heat source concentration, increasing the risk of local hot spots.

Heat conduction path: The heat conduction path of double-layer boards is relatively limited and needs to be optimized to improve heat dissipation efficiency.

2. Heat dissipation solution

1. Optimize PCB layout

Optimizing PCB layout is the basis for improving heat dissipation efficiency. The following factors should be considered when laying out:

The first is to disperse the heating components to avoid the concentration of heat sources; the second is to ensure the shortest heat conduction path between the heating components and the heat dissipation components (such as radiators or heat sinks); the third is to use thermal simulation software to predict hot spots and guide layout optimization.

2. Use high thermal conductivity materials

Choosing a substrate material with high thermal conductivity, such as a ceramic substrate or a high Tg (glass transition temperature) FR-4 material, can improve the efficiency of heat conduction from the component to the PCB.

3. Increase heat conduction path

By increasing the thermal path, such as using thermal glue, thermal pads or thermal paste, the heat is conducted from the component to the PCB surface, and then dissipated to the environment through the heat sink.

4. Application of radiators and heat sinks

Installing radiators or heat sinks at appropriate locations on double-layer boards can significantly improve heat dissipation efficiency. Heat sink design should consider air flow paths to optimize heat dissipation.

5. Heat pipe and steam chamber cooling technology

For high power density applications, heat pipe or vapor chamber cooling techniques can be used. These technologies use the principle of phase change to efficiently conduct heat from the heat source to the heat sink surface.

6. Surface treatment technology

Using blackening treatment or other surface treatment technologies can improve the absorption and emission capabilities of infrared radiation on the PCB surface, thereby enhancing the natural convection heat dissipation effect.

7. Fan and forced air cooling

Where space permits, fans can be used for forced air cooling to improve heat dissipation efficiency. Fan selection and placement should take into account air flow optimization.

8. Liquid cooling system

For applications with extremely high heat loads, liquid cooling systems may be considered. By transferring heat into the liquid, the heat is dissipated through the liquid circulation system.

Effective thermal solutions are important to ensure the reliability and performance of double-layer PCB. By comprehensively considering layout optimization, material selection, cooling component application, and advanced cooling technology, a cooling solution can be designed to meet different heat load requirements. As electronic devices move toward higher performance and smaller sizes, research and innovation in heat dissipation technology will continue to address the growing heat dissipation challenges.