What are the types of PCBA assembly?

There are many types of PCBA assembly, among which SMD assembly is one of them. SMD assembly means that all electronic components are pasted on the PCB in the form of patches, then fixed by hot air or hot melt adhesive, and finally welded to form a complete PCB. SMD assembly is an efficient and highly reliable assembly method because it can reduce the wiring between electronic components, thereby reducing the size and weight of the circuit board, and improving signal transmission speed and stability. In addition, patch assembly can also improve production efficiency, reduce production costs, and save time and human resources.

In PCBA patch assembly: SMT and DIP. SMT (Surface Mount Technology) is a surface mount technology. By pasting electronic components directly on the surface of the PCB, the component pins do not need to penetrate the circuit board to complete the assembly. This assembly method is suitable for small, lightweight, and highly integrated of electronic products. The advantages of surface mount assembly are saving space, improving production efficiency, reducing costs, and improving product reliability, but the quality requirements for electronic components are higher, and it is not easy to repair and replace. DIP ( dual in-line package ) is a plug-in technology, which needs to insert electronic components into the PCB surface through holes, and then solder and fix them. This assembly method is suitable for large-scale, high-power, high-reliability electronic products. The advantage of plug-in assembly is that the structure of the plug-in itself is relatively stable and easy to repair and replace. However, plug-in assembly requires a large space and is not suitable for small products. In addition to these two types, there is another assembly method called a hybrid assembly, which is to use both SMT and DIP technologies for assembly to meet the assembly requirements of different components. Hybrid assembly can take into account the advantages of SMT and DIP, and can also effectively solve some problems in assembly, such as complicated PCB layouts. In actual production, the hybrid assembly has been widely used.

Common PCBA assembly types include single-sided assembly, double-sided assembly, and multi-layer board assembly. Single-sided assembly is only assembled on one side of the PCB, which is suitable for simple circuit boards; double-sided assembly is assembled on both sides of the PCB, suitable for complex circuit boards; multi-layer board assembly is to assemble multiple PCBs into one by stacking Overall, suitable for high-density circuit boards. In addition, high-end assembly technologies such as BGA (Ball Grid Array) assembly and COB (Chip on Board) assembly are suitable for high-performance, high-density, and high-reliability circuit boards.

In general, patch assembly is a very common, efficient, and highly reliable assembly method widely used in producing various electronic products.